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Solid-State Microrefrigerator on a Chip
Introduction Temperature control of microelectronic devices has become more important in recent years. Device miniaturization and higher switching speeds have increased power dissipation substantially....
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Internal Combustion Used to Make Metal Oxide Thin-Film Electronics
As amorphous silicon electronics reach their physical limits, researchers at Northwestern University have figured out a way to make amorphous oxides cheaply and reliably. Amorphous oxides are faster...
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Researcher Receives IEEE Field Award
Rao R. Tummala, a researcher and educator who has made seminal contributions to microelectronics packaging, has been honored by IEEE with the 2011 IEEE Field Award in Components, Packaging and...
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Thin-Film Thermoelectrics with Improved Cooling Efficiency
Nextreme Thermal Solutions’ thin-film thermoelectric technology has achieved a 60.1°C temperature difference between its cold and hot sides at an ambient temperature of 24.7°C, bringing it on par with...
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Diamond-Thin Films Cool Electronics
Two new studies performed at the U.S. Department of Energy’s Argonne National Laboratory have revealed a new pathway for materials scientists to use previously unexplored properties of...
View Article55°C Cooling Performance Thin-Film Thermoelectric Coolers
Nextreme Thermal Solutions has announced the availability of new thin-film thermoelectric cooling products that offer 55°C of cooling performance at an ambient temperature of 25°C. The 55°C temperature...
View ArticleSolid-State Microrefrigerator on a Chip
Introduction Temperature control of microelectronic devices has become more important in recent years. Device miniaturization and higher switching speeds have increased power dissipation substantially....
View ArticleInternal Combustion Used to Make Metal Oxide Thin-Film Electronics
As amorphous silicon electronics reach their physical limits, researchers at Northwestern University have figured out a way to make amorphous oxides cheaply and reliably. Amorphous oxides are faster...
View ArticleResearcher Receives IEEE Field Award
Rao R. Tummala, a researcher and educator who has made seminal contributions to microelectronics packaging, has been honored by IEEE with the 2011 IEEE Field Award in Components, Packaging and...
View ArticleThin-Film Thermoelectrics with Improved Cooling Efficiency
Nextreme Thermal Solutions’ thin-film thermoelectric technology has achieved a 60.1°C temperature difference between its cold and hot sides at an ambient temperature of 24.7°C, bringing it on par with...
View ArticleDiamond-Thin Films Cool Electronics
Two new studies performed at the U.S. Department of Energy’s Argonne National Laboratory have revealed a new pathway for materials scientists to use previously unexplored properties of...
View Article55°C Cooling Performance Thin-Film Thermoelectric Coolers
Nextreme Thermal Solutions has announced the availability of new thin-film thermoelectric cooling products that offer 55°C of cooling performance at an ambient temperature of 25°C. The 55°C temperature...
View Article